60.60 Standard published Jun 30, 1988
IEC
International Standard
31.200 Integrated circuits. Microelectronics
Published
Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.
PUBLISHED
IEC 60748-20:1988 ED1
60.60
Standard published
Jun 30, 1988
PUBLISHED
IEC 60748-20:1988/AMD1:1995 ED1
ABANDON
IEC 60748-20 ED2