IEC 62899-202-10:2023 ED1

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer IEC 62899-202-10:2023 ED1

Publication date:   Aug 16, 2023

General information

60.60 Standard published   Aug 16, 2023


TC 119

International Standard

29.035.01   Insulating materials in general | 31.180   Printed circuits and boards



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IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

Life cycle


IEC 62899-202-10:2023 ED1
60.60 Standard published
Aug 16, 2023