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Materials for printed boards and other interconnecting structures –<br /> Part 2-XX: Reinforced base materials clad and unclad –<br /> Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
10.60 Close of voting
Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
10.60 Close of voting
Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant
10.60 Close of voting
Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards
10.60 Close of voting
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library
00.99 Approval to ballot proposal for new project
Thermal Endurance Test Method for Flexible Optic-Electric Circuit
00.99 Approval to ballot proposal for new project
Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)
60.60 Standard published
Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process
60.60 Standard published
Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
60.60 Standard published
Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
60.60 Standard published
Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)
60.60 Standard published
Software Interface for Maintenance Information Collection and Analysis (SIMICA)
60.60 Standard published
Software Interface for Maintenance Information Collection and Analysis (SIMICA) - Part 2: Exchanging Maintenance Action Information via the Extensible Markup Language (XML)
60.60 Standard published
Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML
60.60 Standard published
Behavioural languages - Part 1-1: VHDL Language Reference Manual
60.60 Standard published
Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions
60.60 Standard published
Behavioural languages - Part 7: SystemC R Language Reference Manual
60.60 Standard published
