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PWI TR 47D-2 ED1

Future IEC TR 60191-7-3 Ed.1: Proposal of new thermal model format for semiconductor packages

General information

10.98   New project rejected   Feb 17, 2021

IEC

TC 47/SC 47D

Technical Report

Life cycle

NOW

ABANDON
PWI TR 47D-2 ED1
10.98 New project rejected
Feb 17, 2021