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PWI TR 47D-1 ED1

Future IEC TR 63xxx-1 ED1: Thermal standardization on semiconductor packages – Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

General information

30.97   End of interruption of work - split/merged   Feb 17, 2021

IEC

TC 47/SC 47D

Technical Report

Life cycle

NOW

ABANDON
PWI TR 47D-1 ED1
30.97 End of interruption of work - split/merged
Feb 17, 2021