PWI TR 47D-1 ED1

Future IEC TR 63xxx-1 ED1: Thermal standardization on semiconductor packages – Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages PWI TR 47D-1 ED1

General information

Current stage: 30.97 End of interruption of work - split/merged Feb 17, 2021

Originator: IEC

Owner: TC 47/SC 47D

Type: Technical Report

Life cycle

NOW

ABANDON
PWI TR 47D-1 ED1
30.97 End of interruption of work - split/merged
Feb 17, 2021

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