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PWI 47D-8

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging PWI 47D-8

General information

10.98   New project rejected   Jan 21, 2026

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PWI 47D-8
10.98 New project rejected
Jan 21, 2026




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