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prEN IEC 61189-3-303

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards prEN IEC 61189-3-303

General information

10.99   New project approved   Apr 29, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Life cycle

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IN_DEVELOPMENT
prEN IEC 61189-3-303
10.99 New project approved
Apr 29, 2024




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