Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board. Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser. Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.
ABANDON
prEN 60249-3-3
40.98
Project deleted
May 6, 2001
