prEN 60191-6-11

Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA) prEN 60191-6-11

Current stage: 40.98 Project deleted Apr 26, 2005

Originator: CENELEC

Owner: CLC/SR 47D Mechanical standardization of semiconductor devices

Type: European Norm

ABANDON
prEN 60191-6-11
40.98 Project deleted
Apr 26, 2005

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