prEN 60191-2

Mechanical standardization for semiconductor devices - Part 2: Dimensions - Small outline J-lead package (SOJ) - 0,80 mm pitch (Outline 163E)

General information

40.98   Project deleted   Sep 26, 2001

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

Life cycle

NOW

ABANDON
prEN 60191-2
40.98 Project deleted
Sep 26, 2001