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prEN 60191-2

Mechanical standardization for semiconductor devices - Part 2: Dimensions - Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug down, T-PQFP-G (Outline 153E)

General information

40.98   Project deleted   Sep 26, 2001

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

Life cycle

NOW

ABANDON
prEN 60191-2
40.98 Project deleted
Sep 26, 2001