prEN 60191-2

Mechanical standardization for semiconductor devices - Part 2: Dimensions - Pin plastic fine pitch ball grid array package (P-FBGA) family for memory (Outline 156) prEN 60191-2

Current stage: 40.98 Project deleted Sep 26, 2001

Originator: CENELEC

Owner: CLC/SR 47D Mechanical standardization of semiconductor devices

Type: European Norm

ABANDON
prEN 60191-2
40.98 Project deleted
Sep 26, 2001

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