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PNW 91-1478

Future 61189-2-xxx: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for base materials for rigid printed boards – Decomposition Temperature Td

General information

10.98   New project rejected   Aug 10, 2018

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
PNW 91-1478
10.98 New project rejected
Aug 10, 2018