PNW 91-1478

Future 61189-2-xxx: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for base materials for rigid printed boards – Decomposition Temperature Td PNW 91-1478

General information

Current stage: 10.98 New project rejected Aug 10, 2018

Originator: IEC

Owner: TC 91

Type: International Standard

Life cycle

NOW

ABANDON
PNW 91-1478
10.98 New project rejected
Aug 10, 2018

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