Menu

0

PNW 47D-926 ED1

Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis

General information

10.98   New project rejected   Sep 3, 2021

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PNW 47D-926 ED1
10.98 New project rejected
Sep 3, 2021