PNW 47D-926 ED1

Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis PNW 47D-926 ED1

General information

Current stage: 10.98 New project rejected Sep 3, 2021

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

Life cycle

NOW

ABANDON
PNW 47D-926 ED1
10.98 New project rejected
Sep 3, 2021

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