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PNW 47D-895

Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound PNW 47D-895

General information

10.98   New project rejected   Dec 22, 2017

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PNW 47D-895
10.98 New project rejected
Dec 22, 2017




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