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PNW 47D-869A ED1

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound

General information

10.98   New project rejected   Feb 19, 2016

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PNW 47D-869A ED1
10.98 New project rejected
Feb 19, 2016