0

PNW 47D-869A ED1

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound PNW 47D-869A ED1

General information

10.98   New project rejected   Feb 19, 2016

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PNW 47D-869A ED1
10.98 New project rejected
Feb 19, 2016




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version