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PNW 47D-860 ED1

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool

General information

10.98   New project rejected   Jan 15, 2016

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

ABANDON
PNW 47D-860 ED1
10.98 New project rejected
Jan 15, 2016