ISO/WD 4825-3

Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 3: Evaluation of heat transfer characteristic of metalized ceramic substrates in the horizontal direction for use in power modules

Scope

This document defines a method for evaluating effective in-plane thermal conductivity and conductance of a metalized ceramic substrate bearing a heater chip as an imitation of a SiC power semiconductor. The method provides an indicator for in-plane heat transfer properties of metalized ceramic substrates employed in high-power modules.