ISO/TS 10303-410:2018

Industrial automation systems and integration — Product data representation and exchange — Part 410: Application module: AP210 electronic assembly interconnect and packaging design

Publication date:   Dec 18, 2018

Scope

ISO/TS 10303-410:2018-11 specifies the application module for
AP210 electronic assembly interconnect and packaging design.



The following are within the scope of
ISO/TS 10303-410:2018-11:



the
representation of requirements for, design of, and application of electrical and electrotechnical components, interconnect,
and assemblies.
Included are capabilities to represent the various requirements and sources levied on these items,
as well as constraints arising from manufacturing processes.
Network and other analysis of proposed or actual design is supported, as is applications that map from the network listing
to the layout.
Two dimensional and three dimensional assembly and interconnect design is supported,
as is microwave and embedded design.

The hierarchical description of the functionality of the electronic assembly or interconnect
or devices that are used in an electronic assembly or interconnect;
The hierarchical description of the functional objects that are combinations of one or more
functional objects;
The configuration management of the functional objects that are being developed concurrently;The configuration management of analytical models that are being developed concurrently;The explicit interface to analytic models that are used to define the behaviour of a functional
object, a device, a physical object, an electronic assembly, or an interconnect;
The description of the connection among the functional objects;The description of the connection among the devices used in the electronic assembly or
interconnect;
The description of the requirements for physical interconnection;The physical layout of the electronic assembly, including a description of the placement of
the physical objects in the electronic assembly;
The description of the bare interconnect, including the conductive and non-conductive materials
and patterns;
The functional and physical description of devices or physical objects, including material
characteristics and composition;
The functional usage and physical usage description of devices or physical objects, including
material characteristics and composition;
The functional and physical description of devices or physical objects realized as part of the
interconnect, including material characteristics and composition;
The functional usage and physical usage description of devices or physical objects realized
as part of the interconnect, including material characteristics and composition;
The description of the requirements and constraints on the design of the electronic assembly
that assure product performance, incorporate quality, and enhance manufacturing process
capabilities;
The description of the requirements and constraints on the design of the interconnect that
assure product performance, incorporate quality, and enhance manufacturing process capabilities;
The configuration management of electronic assembly design descriptions;The configuration management of interconnect design descriptions;The allocation of certain details of the interconnect design description to the usage description
of a physical object;
The allocation of certain details of the electronic assembly design description to the usage
description of a physical object;
The description of electronic assemblies to implement various functional domains including,
but not limited to, analogue, digital, video, radio frequency, and microwave;
The description of interconnect to implement various functional domains including, but not
limited to, analogue, digital, video, radio frequency, and microwave;
The configuration management of constituent parts that are electronic assemblies or interconnect
and that are being concurrently developed;
The configuration management of documents that contain requirements;The allocation of requirements to functional objects, physical objects, and the physical
implementation;
The allocation of requirements from functional objects to their physical implementation;The allocation of each specific connection among the devices used in the electronic assembly
to the component or group of components that realizes that connection;
The association of characteristics to functional objects, physical objects, and analytical
models;
The identification of planned parameters for functional objects, electronic assemblies, interconnect,
components, and analytical models;
The identification of actual parameters for functional objects, electronic assemblies, interconnect,
components, and analytical models.