ISO/TS 10303-1650:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die

Publication date:   Dec 18, 2018

General information

90.93 Standard confirmed   Aug 4, 2022

ISO

ISO/TC 184/SC 4 Industrial data

Technical Specification

25.040.40   Industrial process measurement and control

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Scope


ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.



The following is within the scope of
ISO/TS 10303-1650:2018-11:



The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.

definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO/TS 10303-1650:2014

NOW

PUBLISHED
ISO/TS 10303-1650:2018
90.93 Standard confirmed
Aug 4, 2022