ISO/TS 10303-1650:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die

Publication date:   Dec 18, 2018

Scope

ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.



The following is within the scope of
ISO/TS 10303-1650:2018-11:



The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.

definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.