ISO 9455-17:2002

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

Publication date:   Dec 9, 2002

95.99 Withdrawal of Standard   Jan 10, 2024

General information

95.99 Withdrawal of Standard   Jan 10, 2024

ISO

ISO/TC 44/SC 12 Soldering materials

International Standard

25.160.50   Brazing and soldering

Buying

  Withdrawn

PDF - €76.23

  English   French  



Buy

Scope

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Life cycle

NOW

WITHDRAWN
ISO 9455-17:2002
95.99 Withdrawal of Standard
Jan 10, 2024

REVISED BY

ABANDON
ISO/PWI 9455-17

PUBLISHED
ISO 9455-17:2024