IEC TS 63709-2 ED1

Function and the mechanical dimensions of the interfaces of liquid cooling for IT applications<br /> Part 2: Single phase direct to chip liquid cooling components in electronic enclosures in the IEC60297 series of standards IEC TS 63709-2 ED1

Current stage: 50.00 Final text received or FDIS registered for formal approval Jul 16, 2026

Next stage: CDTS Next stage date : Sep 10, 2026

Originator: IEC

Type: Technical Specification

IN_DEVELOPMENT
IEC TS 63709-2 ED1
50.00 Final text received or FDIS registered for formal approval
Jul 16, 2026

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