IEC TS 63444:2026 ED2

Industrial networks - Ethernet-APL port profile / Ethernet-SPE profile specification IEC TS 63444:2026 ED2

Publication date:   Jun 4, 2026

General information

60.60   Standard published   Jun 4, 2026

IEC

TC 65/SC 65C

Technical Specification

29.240   Power transmission and distribution networks

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Scope

IEC TS 63444:2026 is applicable to process automation equipment using a 10BASE-T1L compliant Physical Layer (PHY). Ethernet-APL intrinsically safe profiles with different predefined entity or limitation parameters (for example voltage, current, power, capacitance, inductance, cable length) simplify the examination of the interconnection of different Ethernet-APL ports. Furthermore, this document is also applicable to factory and building automation and control equipment using a 10BASE-T1L compliant, and Power over Data Lines (PoDL) compliant Physical Layer (PHY) for non-intrinsically safe Ethernet installations.
NOTE In this document the term Ethernet-SPE is used for PoDL compliant PHY.
The following technical features are part of this document:
- topology with trunk and spur installation capability;
- 2-wire technology (full-duplex communication data rate of 10 Mbit/s);
- long distance (refers to cable lengths of several hundred meters, with spans up to 1 000 m);
- intrinsic safety (installation of Ethernet-capable field devices in hazardous areas);
- power supply to field devices over the same 2-wire cable used for data communication;
- non-intrinsically safe Ethernet installation in factory and building automation.
This second edition cancels and replaces the first edition published in 2023. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) new power class for Ethernet-APL;
b) addition of Ethernet-SPE;
c) clarification of usability of Ethernet-APL in non-hazardous locations.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC TS 63444:2023 ED1

NOW

PUBLISHED
IEC TS 63444:2026 ED2
60.60 Standard published
Jun 4, 2026




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