0

IEC TS 62647-4:2018 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling IEC TS 62647-4:2018 ED1

General information

30.98   Project deleted   Jun 13, 2014

IEC

TC 107

Technical Specification

03.100.50   Production. Production management | 31.020   Electronic components in general | 49.060   Aerospace electric equipment and systems

Scope

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

Life cycle

NOW

ABANDON
IEC TS 62647-4:2018 ED1
30.98 Project deleted
Jun 13, 2014




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version