IEC TS 62610-1:2009 ED1

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) IEC TS 62610-1:2009 ED1

Publication date:   Sep 16, 2009

General information

60.60 Standard published   Sep 16, 2009

IEC

TC 48/SC 48D

Technical Specification

31.240   Mechanical structures for electronic equipment

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Scope

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:
1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

Life cycle

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PUBLISHED
IEC TS 62610-1:2009 ED1
60.60 Standard published
Sep 16, 2009