IEC TS 61249-3-1 ED1

Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types)

General information

30.98   Project deleted   Oct 11, 2013

IEC

TC 91

Technical Specification

Life cycle

NOW

ABANDON
IEC TS 61249-3-1 ED1
30.98 Project deleted
Oct 11, 2013