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IEC TR 60286-7:2019 ED1

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components IEC TR 60286-7:2019 ED1

Publication date:   Oct 14, 2019

General information

60.60 Standard published   Oct 14, 2019

IEC

TC 40

Technical Report

31.020   Electronic components in general | 31.240   Mechanical structures for electronic equipment

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Scope

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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PUBLISHED
IEC TR 60286-7:2019 ED1
60.60 Standard published
Oct 14, 2019