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IEC 63567-3 ED1

Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light

General information

40.20   DIS ballot initiated: 12 weeks   Sep 11, 2026

PRVC    Dec 4, 2026

IEC

TC 47

International Standard

31.080.99   Other semiconductor devices

Life cycle

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IN_DEVELOPMENT
IEC 63567-3 ED1
40.20 DIS ballot initiated: 12 weeks
Sep 11, 2026