60.60 Standard published Nov 28, 2018
IEC
International Standard
31.200 Integrated circuits. Microelectronics
Published
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
PUBLISHED
IEC 63011-2:2018 ED1
60.60
Standard published
Nov 28, 2018