0

IEC 62951-5:2019 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials IEC 62951-5:2019 ED1

Publication date:   Feb 27, 2019

General information

60.60   Standard published   Feb 27, 2019

IEC

TC 47

International Standard

31.080.99   Other semiconductor devices

Buying

Published

Language in which you want to receive the document.

Scope

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

Life cycle

NOW

PUBLISHED
IEC 62951-5:2019 ED1
60.60 Standard published
Feb 27, 2019




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version