IEC 62899-402-1:2017(E) specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.
WITHDRAWN
IEC 62899-402-1:2017 ED1
99.60
Withdrawal effective
May 9, 2025
PUBLISHED
IEC 62899-402-1:2025 ED2