99.60 Withdrawal effective Apr 22, 2021
WPUB
IEC
International Standard
33.180.20 Fibre optic interconnecting devices
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages
WITHDRAWN
IEC 62148-21:2019 ED1
99.60
Withdrawal effective
Apr 22, 2021
PUBLISHED
IEC 62148-21:2021 ED2