IEC 62137-1-1/FRAGF ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test IEC 62137-1-1/FRAGF ED1

Scope

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.