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IEC 61249-3-5:1999 ED1

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films IEC 61249-3-5:1999 ED1

Publication date:   Feb 10, 1999

General information

60.60   Standard published   Feb 10, 1999

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

Life cycle

NOW

PUBLISHED
IEC 61249-3-5:1999 ED1
60.60 Standard published
Feb 10, 1999




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