IEC 61249-2-54 ED1

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications IEC 61249-2-54 ED1

General information

30.60 Close of voting/ comment period   Nov 8, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Life cycle

NOW

IN_DEVELOPMENT
IEC 61249-2-54 ED1
30.60 Close of voting/ comment period
Nov 8, 2024