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IEC 61249-2-51:2023 ED1

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad IEC 61249-2-51:2023 ED1

Publication date:   May 11, 2023

General information

60.60   Standard published   May 11, 2023

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

Life cycle

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PUBLISHED
IEC 61249-2-51:2023 ED1
60.60 Standard published
May 11, 2023




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