0

IEC 61191-4:2017 ED2

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies IEC 61191-4:2017 ED2

Publication date:   Jul 26, 2017

General information

60.60 Standard published   Jul 26, 2017

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

Buying

Published

Language in which you want to receive the document.

Scope

IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61191-4:1998 ED1

NOW

PUBLISHED
IEC 61191-4:2017 ED2
60.60 Standard published
Jul 26, 2017