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IEC 61191-3/FRAGF ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies IEC 61191-3/FRAGF ED2

General information

30.97   End of interruption of work - split/merged   Sep 20, 2019

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

Scope

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Life cycle

NOW

ABANDON
IEC 61191-3/FRAGF ED2
30.97 End of interruption of work - split/merged
Sep 20, 2019




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