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IEC 61191-2:1998 ED1

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Publication date:   Aug 28, 1998

General information

99.60 Withdrawal effective   Jun 5, 2013

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

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  Revised

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Scope

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Life cycle

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WITHDRAWN
IEC 61191-2:1998 ED1
99.60 Withdrawal effective
Jun 5, 2013

REVISED BY

WITHDRAWN
IEC 61191-2:2013 ED2