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IEC 61191-1:1998 ED1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Publication date:   Aug 28, 1998

General information

99.60 Withdrawal effective   May 21, 2013

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

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  Revised

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Scope

Prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also included are recommendations for good manufacturing processes.

Life cycle

NOW

WITHDRAWN
IEC 61191-1:1998 ED1
99.60 Withdrawal effective
May 21, 2013

REVISED BY

WITHDRAWN
IEC 61191-1:2013 ED2