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IEC 61190-1-7 ED1

Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly

General information

30.98   Project deleted   Oct 30, 2007

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61190-1-7 ED1
30.98 Project deleted
Oct 30, 2007