Menu

Standards search
IEC 61190-1-6 ED1

IEC 61190-1-6 ED1

Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications

General information

Current stage: 30.98 Project deleted Oct 30, 2007

Originator: IEC

Owner: TC 91

Type: International Standard

Life cycle

NOW

ABANDON
IEC 61190-1-6 ED1
30.98 Project deleted
Oct 30, 2007