IEC 61190-1-6 ED1

Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications IEC 61190-1-6 ED1

Current stage: 30.98 Project deleted Oct 30, 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ABANDON
IEC 61190-1-6 ED1
30.98 Project deleted
Oct 30, 2007

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