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IEC 61189-5-503/FRAGF ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards IEC 61189-5-503/FRAGF ED1

General information

30.97   End of interruption of work - split/merged   Sep 20, 2019

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Scope

IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

Life cycle

NOW

ABANDON
IEC 61189-5-503/FRAGF ED1
30.97 End of interruption of work - split/merged
Sep 20, 2019




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