IEC 61189-3/AMD1/FRAGF ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Current stage: 30.97 End of interruption of work - split/merged Aug 11, 2006

Originator: IEC

Owner: TC 91

Type: International Standard

ABANDON
IEC 61189-3/AMD1/FRAGF ED1
30.97 End of interruption of work - split/merged
Aug 11, 2006