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IEC 61189-3/AMD1/FRAGF ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) IEC 61189-3/AMD1/FRAGF ED1

General information

30.97   End of interruption of work - split/merged   Aug 11, 2006

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61189-3/AMD1/FRAGF ED1
30.97 End of interruption of work - split/merged
Aug 11, 2006

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2




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